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More Sony Xperia's




Sony Xperia ZL is likely to be the dual-SIM and less expensive version of the Xperia Z, according to fresh details that have surfaced on the web.
                    More Sony Xperia Z, ZL details surface ahead of CES 2013

More details have surfaced on the web with regards to Sony's Xperia Z and Xperia ZL smartphones, expected to be unveiled at the Consumer Electronics Show (CES) 2013 event starting next week.
According to reports, the main difference between the two devices is that the Xperia ZL will be the dual-SIM variant of the Xperia Z. The Xperia ZL is also rumoured to be less expensive than its counterpart. Moreover, the Xperia Z will be dust and water resistant.
An alleged photo of the Xperia Z, previously rumoured as the Xperia Yuga, shows a 19,990 THB (Thailand) price tag, which is around $660.
Earlier this week, the Sony mobile website inadvertently leaked images of the Xperia ZL and Z. While the specs appear to be similar for the both devices, there are certain visual elements that keep the two apart – the ZL is slimmer and the front facing camera on the Xperia ZL is below the display, and not above it as on the Xperia Z.
The common specifications include a 1.5GHz quad-core Qualcomm Snapdragon S4 Pro processor, 2GB of RAM and a 13MP camera, 5-inch full HD display and Android 4.1.2 Jelly Bean out of the box. In the meanwhile, check out our previous coverage on the CES 2013 here.



10 arrested for cyber crime




FBI arrests ten as part of cybercrime probe.
FBI arrests ten as part of cybercrime probe.

Ten individuals have been arrested as part of an investigation into international cybercrime rings.
The US Department of Justice and the FBI, along with international law enforcement agencies, announced the arrests of the individuals, who come from the UK, the USA, Bosnia and Herzegovina, Croatia, Macedonia, New Zealand and Peru.
“The operation identified international cyber crime rings that are linked to multiple variants of the Yahos malicious software, or malware, which is linked to more than 11 million compromised computer systems and over $850m in losses via the Butterfly Botnet, which steals computer users’ credit card, bank account, and other personal identifiable information,” a statement from the agencies said.
Botnets, short for robot networks, are made up of compromised computer systems and can be used by cyber criminals to execute distributed denial of service attacks, send spam emails, and conduct underground organised criminal activity, to include malware distribution.
The FBI said Facebook also assisted with the operation, by helping to identify the root cause, the perpetrators, and those affected by the malware. Yahos targeted Facebook users from 2010 to October 2012, and security systems were able to detect affected accounts and provide tools to remove these threats.
The FBI has recommended that computer users update their applications and operating system on a regular basis to reduce the risk of compromise and perform regular anti-virus scanning of their computer system. It is also helpful to disconnect personal computers from the Internet when the machines are not in use, it said.

Baby Pics of Universe




The seven faraway galaxies found using the Hubble Space Telescope.
The seven faraway galaxies found using the Hubble Space Telescope.
Credit: NASA, ESA, R. Ellis (Caltech), and the UDF 2012 Team

Astronomers using the Hubble Space Telescope have found seven galaxies that formed relatively shortly after the Universe's birth some 13.7 billion years ago.
Scientists described them "as baby pictures of the universe". One of the objects may be the oldest galaxy yet found, dating back to a time when the universe was just 380 million years old, a fraction of its current age.
NASA’s associate administrator for science John Grunsfeld said: "These early galaxies represent the building blocks of present-day galaxies."
The discovery of galaxies dating back to the Universe's early years should help scientists figure out what happened after the ‘dark ages,’ a period of time about 200 million years after the Big Bang explosion when cooling clouds of hydrogen, clumped together by gravity, began to ignite, triggering the first generation of stars.
"It was a very important moment in cosmic history," said astronomer Richard Ellis, with the California Institute of Technology in Pasadena.
Scientists do not know exactly when this "cosmic dawn" occurred and whether it was a single, dramatic event that caused all the galaxies to form their first stars, or whether it happened more gradually over millions of years.
The discovery of seven galaxies spanning a period between 350 million and 600 million years after the Big Bang supports theories that the cosmic dawn was a drawn-out affair, with galaxies slowly building up their stars and chemical elements over time, said Brant Robertson of the University of Arizona in Tucson.
Astronomers plan follow-up studies after Hubble's successor, the James Webb Space Telescope, launches in 2018.
The research appears in the Astrophysical Journal Letters.

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Scientist created new material for electric streches




The new material has squared stiff islands for the protection of brittle electronic devices.

Swiss scientists have created a new material that could speed the development of stretchy, wearable electronic devices.
The researchers, from the Swiss Federal Institute of Technology in Zurich, have come up with a material that mimicks the way tendons connect to bones.
The stretchable electronics industry is in its infancy but devices that are able to flex without breaking could revolutionise devices from smartphones and solar cells to medical implants. But while circuits and wiring are fine on rigid surfaces like those in a tablet computer, they break easily when combined with materials that stretch.
"You have two materials with very different mechanical properties," Andre Studart, one of the researchers said. "The challenge is to bridge these different properties."
The team has come up with a stretchy material made from polyurethane that contains "islands" stiff enough to house and protect delicate circuits.
While the soft part can stretch by 350 per cent, the stiff regions created by impregnating the material with tiny platelets of aluminium oxide and a synthetic clay called laponite, hardly deform and can protect the electronics.
The material, presented in research published in the journal Nature Communications, is made from bonded layers and because the concentration of the platelets is gradually increased, the junction between the stretchy and stiff parts is also durable.
"There are many biological materials that have these properties as well, like the way tendons link muscle to bone," said Studart. "But there are not so many examples in synthetic materials."
The researchers say their technique could also be used to build synthetic cartilage or false teeth with better matches to their natural counterparts.

Intel has launched the first of its family of system-on-chip (SoC)




Intel has taken its existing Saltwell core developed for mobile phones and put it into a family of server-oriented processors.

Intel has launched the first of its family of system-on-chip (SoC) processors intended for low-power data-centre equipment, but a benchmark put together by the company has revealed that, in terms of compute efficiency, its existing Xeon E3 processors remain more energy efficient.
Chris Feltham, data centre product manager for Intel EMEA, described the Atom S1200 as “our first data centre-focused SoC” in what what is expected to be a gradually expanding portfolio of processors designed for different applications. Describing the server space in terms of three parameters – CPU performance, I/O performance and memory capacity – Feltham said the new Atom devices sit at the low end of each of those, suiting the new processors to environments such as basic web hosting and communications switches.
The S1200 is based on the same Saltwell core as that used in Atom processors aimed at the mobile tablet market and is based on the company’s 32nm process rather than the 22nm finFET process used in its mainstream products. Running at up to 2GHz, the fastest device in the three-member S1200 family –the S1260 – consumes up to 8.5W, about five times less than the existing, four-core Xeon E3.
Feltham said, thanks to integration and lower individual power consumption, a manufacturer could put five times as many Atom S1200s into a rack than Xeon E3s. Feltham said that web hosts looking to provide dedicated servers to customers, Atom provided a good fit.
“When it comes to revenue to Intel, it’s about the same for both of these racks,” says Feltham. “It really depends on the customer in question what they are trying to achieve as to which approach is better. The choice for performance per watt would still be Xeon.”
In its benchmark, Intel calculated that a rack fitted with 112 Xeon E3s – the maximum possible today in terms of space – would outperform a rack containing 560 Atom S1260s. With a power per node of 60W versus 20W, the Atom-based rack would consume 40 per cent more power.
Intel expects to follow the Centerton next year with follow-up called Avoton that uses the 22nm process and which will provide higher integration. Although it has an onchip PCI Express controller, the S1200 lacks an Ethernet port.
“Avoton wil bring Ethernet integrated into the SoC,” said Feltham.

IBM uses light for speed transmission




IBM Silicon Nanophotonics chip combining optical and electrical circuits (credit IBM)
IBM Silicon Nanophotonics chip combining optical and electrical circuits (credit IBM)

IBM has announced a major advance in the ability to use light instead of electrical signals to transmit information for future computing.
The breakthrough technology, called “silicon nanophotonics”, allows the integration of different optical components side-by-side with electrical circuits on a single silicon chip using, for the first time, sub-100nm semiconductor technology.
Silicon nanophotonics takes advantage of pulses of light for communication and provides a super highway for large volumes of data to move at rapid speeds between computer chips in servers, large datacentres, and supercomputers, thus alleviating the limitations of congested data traffic and high-cost traditional interconnects.
“This technology breakthrough is a result of more than a decade of pioneering research at IBM,” said Dr. John E. Kelly, Senior Vice President and Director of IBM Research.
“This allows us to move silicon nanophotonics technology into a real-world manufacturing environment that will have impact across a range of applications.”
The amount of data being created and transmitted over enterprise networks continues to grow due to an explosion of new applications and services.
Silicon nanophotonics, now primed for commercial development, can enable the industry to keep pace with increasing demands in chip performance and computing power.
Businesses are entering a new era of computing that requires systems to process and analyse, in real-time, huge volumes of information known as Big Data.
Silicon nanophotonics technology provides answers to Big Data challenges by seamlessly connecting various parts of large systems, whether few centimetres or few kilometres apart from each other, and move terabytes of data via pulses of light through optical fibres.
Building on its initial proof of concept in 2010, IBM has solved the key challenges of transferring the silicon nanophotonics technology into the commercial foundry.
By adding a few processing modules into a high-performance 90nm CMOS fabrication line, a variety of silicon nanophotonics components such as wavelength division multiplexers (WDM), modulators, and detectors are integrated side-by-side with a CMOS electrical circuitry.
As a result, single-chip optical communications transceivers can be manufactured in a conventional semiconductor foundry, providing significant cost reduction over traditional approaches.
IBM’s CMOS nanophotonics technology demonstrates transceivers to exceed the data rate of 25Gbps per channel.
In addition, the technology is capable of feeding a number of parallel optical data streams into a single fiber by utilising compact on-chip wavelength-division multiplexing devices.
The ability to multiplex large data streams at high data rates will allow future scaling of optical communications capable of delivering terabytes of data between distant parts of computer systems

intel smaller mobile chip




Intel logo
Intel logo

Intel presented new manufacturing technology that it said keeps it on track to launch a new generation of chips for smartphones and tablets as it rushes to catch up with Qualcomm and other rivals in the fast-growing mobile market.
The world's largest chipmaker dominates the PC industry but has been slow to adapt its processors for mobile gadgets that depend on batteries and demand power efficiency.
At an industry conference in San Francisco this week, Intel reported on the progress of its technology for making SoCs, or "systems-on-a-chip" with features measuring 22 nanometers.
"Intel's 22 nm SoC technology will be ready for high volume manufacturing in 2013," Intel said in a copy of the presentation.
Intel's current mobile SoCs are manufactured at 32 nm, while Qualcomm makes its top-end SoCs at 28 nm and Nvidia uses 40 nm technology.
Manufacturing chips with smaller features allows for better performance and power efficiency.
Intel already makes PC processors at 22 nm, but since SoCs pack more features onto one piece of silicon, manufacturing them at 22 nm is more complicated, said Patrick Moorhead, of Moor Insights & Analysis.
"They (Intel) have all the right ingredients to make a very competitive mobile chip but we won't know if they do until 2013," Moorhead said.
While Intel's industry lead in manufacturing technology is well established, competitors and many on Wall Street say the chipmaker's mobile SoC designs do not stand up to SoCs designed by Qualcomm, Apple and others with technology licensed from Britain's ARM Holdings.

Japan Atomic Plant




Fukushima Daiichi nuclear plant
Fukushima Daiichi nuclear plant

Japan Atomic Power Co may have to decommission one of its reactors after seismologists concluded the plant is sitting over an active faultline, potentially the first permanent shutdown of a nuclear unit in Japan since the Fukushima disaster last year.
"There is no way we can carry out safety assessments for a restart," the chairman of Japan's Nuclear Regulation Authority (NRA), Shunichi Tanaka, said this week at an open meeting after being presented with an assessment there is an active fault under the No. 2 reactor at the Tsuruga nuclear plant.
The government in Japan, one of the world's most seismically active countries, does not allow nuclear plants to be situated over active faultlines.
An NRA panel of seismologists has been reviewing geological records and this month visited Tsuruga to watch the results of boring and other tests.
A fault line extending from below the reactor was assessed to have moved in the past in tandem with another nearby fault, Kunihiko Shimazaki, an NRA commissioner who led the seismic panel, told the meeting.
While Tanaka has no authority to order a permanent shutdown, his comment implies he will not allow the reactor to be restarted, forcing a decision on Japan Atomic over whether to mothball the unit.
A Japan Atomic official who attended the meeting said the company would carry out further seismic studies.
The agency will meet at a later date to make an official announcement on the 1,160 megawatt reactor, the larger of two at the plant in western Japan.
The No. 2 unit started operating in 1987, while the 357-megawatt No. 1 reactor started in 1970.
The NRA is reviewing possible faultlines under or near Tsuruga and five other nuclear stations as part of moves to beef up safety and Tanaka has said any reactors sitting above won't be allowed to restart.
All but two of Japan's nuclear reactors are idled for safety checks after the Fukushima disaster, forcing the country to spend billions of dollars extra on fossil fuels to run power stations.
An earthquake and tsunami in March last year knocked out cooling and power at Tokyo Electric Power Co's Fukushima Daiichi station north of the Japanese capital, causing the biggest release of radiation since Chernobyl in 1986.

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Gate Hall Tickets

Sony Xperia E specifications







  • 2G Network GSM 850 / 900 / 1800 / 1900 
  • 3G Network HSDPA 900 / 2100 - C1505, HSDPA 850 / 1900 / 2100 - C1504 
  • GPRS Up to 86 kbps 
  • 320 x 480 pixels, 3.5 inches, TFT capacitive touchscreen 
  • EDGE Up to 237 kbps 
  • Speed HSDPA, 7.2 Mbps; HSUPA, 5.76 Mbps 
  • WLAN Wi-Fi 802.11 b/g/n, DLNA, Wi-Fi hotspot 
  • Bluetooth Yes, v2.1, EDR 
  • USB Yes, microUSB v2.0 
  • OS Android OS, v4.1 (Jelly Bean) 
  • Chipset Qualcomm MSM7227A Snapdragon 
  • CPU 1 GHz Cortex-A5 
  • GPU Adreno 200 
  • Sensors Accelerometer, proximity 
  • Messaging SMS (threaded view), MMS, Email, IM, Push Email 
  • Browser HTML5 
  • Radio Stereo FM radio with RDS 
  • GPS Yes, with A-GPS support 
  • Java Yes, via Java MIDP emulator 
  • Colors Black, Pink, White 
  • Camera 3.15 MP, 2048x1536 pixels, Geo-tagging

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